IT之家 3 月 27 日消息，在 SEMICON China 2025 展會期間，中微半導體設備（上海）股份有限公司（IT之家以下簡稱“中微公司”）宣佈其自主研發的 12 吋晶圓邊緣刻蝕設備 Primo Halona 正式發佈。

According to AMEC, the 12-inch edge etching equipment Primo Halona adopts its characteristic dual-reactor design, which can flexibly configure up to three dual-reactor reaction chambers, and each reaction chamber can process two wafers at the same time, which can meet the mass production needs of wafer edge etching while ensuring low production costs, so as to achieve higher output density and improve production efficiency.

In addition, the equipment cavity is equipped with a Quadra-arm robotic arm, which is precise and flexible, and the interior of the cavity is designed with corrosion-resistant materials to resist halogen gas corrosion, providing a guarantee for the stability and durability of the equipment.

According to AMEC, Primo Halona is equipped with a unique self-aligning installation design solution, which not only improves the alignment accuracy and parallelism of the upper and lower plates, but also effectively reduces the downtime and maintenance time caused by calibration installation, thereby helping customers optimize production capacity and lean production.

In terms of equipment intelligence, Primo Halona provides an optional integrated measurement module, through which customers can realize local real-time film thickness measurement, one-click compensation and calibration of wafer transfer, achieve better product maintainability, and greatly improve the efficiency of later maintenance.

Recently, AMEC announced that by continuously improving the accuracy of gas control between reactors, the ICP dual-reactor etching machine Primo Twin-Star has made a new breakthrough, and the etching accuracy between reactors has reached 2.0A (sub-angstrom level).

據介紹，這一刻蝕精度在氧化矽、氮化矽和多晶矽等薄膜的刻蝕工藝上，均得到了驗證。該精度約等於矽原子直徑 2.5 埃的十分之一，是人類頭髮絲平均直徑 100 微米的 500 萬分之一。