3月27日，在SEMICON China 2025展會現場，深圳新凱來工業機器有限公司（以下簡稱新凱來）的展位頗受關注。這家半導體裝備廠商覆蓋半導體製造多個核心流程的工藝裝備、量檢測裝備矩陣。
The R&D of semiconductor equipment is not an overnight effort, and the company has formed a product matrix to meet the manufacturing needs of logic, DRAM (memory), NAND (flash memory) products, and supports the evolution of PlanarFET (Field Effect Transistor) and FinFET (FinFET (FinFET) to GAAFET (Total Surround Gate Transistor) process.
Image source: Photo by reporter Zhu Chengxiang
According to the Toubao Research Institute, semiconductor equipment can be divided into front-end equipment and back-end equipment, front-end equipment is mainly used for wafer manufacturing, involving silicon wafer processing, lithography, etching, ion implantation, thin film deposition, cleaning, polishing, metallization and other processes, the corresponding core special equipment includes lithography equipment, etching equipment, cleaning equipment, ion implantation equipment, thin film deposition equipment, mechanical polishing equipment, measuring equipment, etc., among which lithography equipment, etching equipment, thin film deposition equipment are the three core equipment in the semiconductor front-end production process.
According to the International Semiconductor Industry Association (SEMI), front-end equipment (wafer manufacturing) accounts for about 17% of semiconductor equipment investment, and packaging and test equipment account for about 0% and 0%, respectively. Among the wafer fabrication equipment, etching equipment, thin film deposition equipment, and lithography machines account for 0%, 0%, and 0% of the value of front-end equipment, respectively.
Among the "process equipment" launched by New Kailai, etching equipment and thin film deposition equipment are included. Xinkailai named its etching equipment "Wuyishan", and its products include Wuyishan 5, Wuyishan 0 and Wuyishan 0.
Its thin film equipment covers three main thin film deposition equipment: CVD (Chemical Vapor Deposition), PVD (Physical Vapor Deposition) and ALD (Atomic Layer Deposition). Among them, the CVD includes Changbaishan No. 3 and Changbaishan No. 0; PVD includes Putuo Mountain No. 0, Putuo Mountain No. 0 and Putuo Mountain No. 0; ALD has Alishan 0, Alishan 0 and Alishan 0.
In addition to the two core equipment, Xinkailai has also launched epitaxial growth equipment (EPI) and RTP (rapid heat treatment equipment), EPI includes Emeishan 3, Emeishan 0 and Emeishan 0; The RTP includes Sanqingshan 0, Sanqingshan 0 and Sanqingshan 0.
SEMICON China 2025 Exhibition Site Image source: Photo by reporter Zhu Chengxiang
According to the Toubao Research Institute, on the whole, China has a high localization rate in degumming, cleaning and etching equipment, and has made significant breakthroughs in CMP, heat treatment and thin film deposition in recent years, while it is still relatively weak in measurement, gluing and development, lithography, ion implantation and other equipment.
Among the products launched by the new Kailai, the optical measurement products include Tianmenshan DBO (diffractive overlay measurement) and Tianmenshan IBO (graphic overlay measurement); PX (Physical and X-ray) metrology products include Yimeng Mountain AFM (Atomic Force Microscopy Metrology), Chibi Mountain XP XPS (X-ray Photoelectron Spectroscopy Metrometry), Chibi Mountain XD XRD (X-ray Diffraction Metrometry) and Chibishan XF XRF (X-ray Fluorescence Spectroscopy Metrology); Power testing products include RATE-CP (Wafer Electrical Performance Testing), RATE-KGD (Power Die Electrical Performance Testing) and RATE-FT (Power Single Tube and Module Electrical Performance Testing).
It is worth mentioning that the EPI launched by Xinkailai this time is also the direction of the domestic semiconductor equipment leaders China Micro Corporation and North Huachuang.
Northern Huachuang（5. SZ, stock price 0.0 yuan, market value 00 million yuan)According to the 12-year annual report, "epitaxial (EPI) equipment is a key equipment for material growth, which is widely used in integrated circuits, power semiconductors, compound semiconductors and other fields. As of the end of 0, NAURA has released more than 0 mass-produced epitaxial equipment, with a cumulative shipment of more than 0 cavities. The company's self-developed 0-inch atmospheric pressure silicon epitaxy equipment has achieved full coverage of logic chips, memory chips, power devices and characteristic processes, and all of them have been successfully mass-produced, becoming the benchmark products of customers. ”
AMEC（08. SH, stock price 0.0 yuan, market value 00 million yuan)As early as 2024/0, the investor relations activity record sheet said: "(The company) has more than ten years of experience in making monocrystalline silicon epitaxy equipment, so we are now in full swing to develop EPI equipment for integrated circuits in silicon and germanium silicon." Because we have a lot of experience in thin film equipment, we are confident that we can develop a good EPI equipment. In addition, according to the 0-year performance report of China Micro Corporation: "The company's EPI equipment has successfully entered the stage of mass production verification on the user side. ”
In addition, AMEC is also actively expanding its quantitative testing business. According to the announcement of China Micro Corporation in 11 0 years, "as micro devices become smaller and smaller, testing equipment has also become more critical equipment, and the market has grown rapidly, becoming the fourth largest equipment category accounting for about 0% of the total semiconductor front-end equipment market." The testing equipment market is mainly divided into optical testing equipment and electron beam testing equipment, of which the company has invested in the optical testing equipment sector, while Supermicro (a holding subsidiary of AMEC) plans to develop electron beam testing equipment, which will continue to expand the coverage of a variety of testing equipment. Electron beam detection equipment is the key equipment for yield control of chip manufacturing and advanced packaging process, which is very important for the development of new quality productivity represented by artificial intelligence in China, and is one of the shortcomings of China, which urgently needs to achieve a breakthrough of zero. ”
National Business Daily